ZipCURE™ Die Attach is a silver filled thermally conductive JEDEC level 2, Lead Free (260C reflow) die attach designed for a multitude of package types. ZipCURE is extremely hydrophobic, allowing high adhesion under high humidity conditions.
Polysciences, Inc. manufactures a wide range of polymers for the microelectronic and electronic markets including: epoxy encapsulants, glob tops, die attach, wafer level coatings, underfills, conformal coatings, potting compounds, silicone adhesives, thermally conductive polymers and wire sweep eliminating polymers. Additionally, we offer chemicals for CMP, and can custom formulate materials for your unique needs, including synthesis of new or rare polymers in R&D volumes.
For more information, or for help selecting the right material please contact us via email: nvarga@polysciences.com
We pride ourselves in providing a high level of customer service for ALL customers.
| TDS |
Product |
Description |
Cure Type |
Thermal Conductivity
W/m K
|
Tg (C) |
CTE
ά1 / ά2
(ppm/C)
|
Other |
|
682
|
DC1001
|
ZipCURE Die Attach
|
1 part Thermal
|
3.8
|
55
|
40/140
|
JEDEC 2- 260 reflow, silver filled |