Our Electronic Materials Division offers a complete range of products serving the Electronics and High Performance markets, including:
- Economical Epoxy & Silicone Adhesives
- Electronics Encapsulants
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- Potting Compounds
- Electronic Grade Coatings
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With a broad choice of mechanical property and processing options including:
- UV Curable
- 1 Component / 2 Component
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- Room Temperature
- Heat Curable Polymers
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We also manufacture a wide range of polymers for the microelectronic and electronic markets including:
- Epoxy Encapsulants
- Glob Tops
- Die Attach
- Underfills
- Silicone Adhesives
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- Conformal Coatings
- Potting Compounds
- Wafer Level Coatings
- Thermally Conductive Polymers
- Wire Sweep Eliminating Polymers
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Polysciences, Inc. produces a unique array of microelectronic grade encapsulants, adhesives, coatings and potting compounds.
These ultra pure materials offer a wide selection of performance criteria such as viscosity, UV or thermal cure, low or high modulus, screen printable, low CTE, green fire retardant, lead free etc. For applications ranging from PBGA, QFP and smart card encapsulations to wafer level coatings.
Additionally, we offer chemicals for CMP and can custom formulate materials for your unique needs, including synthesis of new or rare polymers in R&D volumes.