Polysciences, Inc. produces a unique array of microelectronic grade encapsulants, adhesives, coatings and potting compounds.
These ultra pure materials offer a wide selection of performance criteria such as viscosity, UV or thermal cure, low or high modulus, screen printable, low CTE, green fire retardant, lead free etc., for applications ranging from PBGA, QFP and smart card encapsulations to wafer level coatings.
Click on a category to view product listings, general product specifications, links to product detail pages and datasheets:
For more detailed information or assistance selecting the right material, please contact: gsandgren@polysciences.com