NoSWEEP™ Wire Bond Encapsulants
NoSWEEP™ Wire Bond Encapsulant is a novel, 100% solids, single component, filled liquid designed for encapsulation of semiconductor devices comprising wire bonds with very narrow diameters, long wires, and ultra fine pitch.
NoSWEEP™ semiconductor encapsulant is dispensed onto the wires immediately after wire bonding, flowing easily between and around the wires without causing sweep or sag and without voids.
NoSWEEP™ is quickly jelled with UV energy to lock the wires in place so the device can be handled and molded with no damage to the wires. Additionally Polysciences has developed a NoSWEEP™ EW7073 system for LQFP and stacked die consisting of a micro extruded ring or line which locks the wires and virtually eliminates wire sweep and sway.
NoSWEEP EW8000 series is an excellent thermal cure globtop and/or liquid encapsulant for ultra fine pitch wire bonded devices.