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Electronic Materials
 

Potting Compounds

Polysciences, Inc. is uniquely suited to manufacture a wide range of Epoxy and Silicone based Potting Compounds, Adhesives and Coatings. We have decades of experience manufacturing ultra pure high performance electronic materials.

For more information or for help selecting the right material please contact us via email: gsandgren@polysciences.com

TDS Product Type Cure Viscosity (cps) Tg
(C)
CTE
ά1 / ά2
(ppm/C)
Description
TBD 02334 Epoxy Potting Compound 2 Part, RT or thermal 400 129 58/230 Low Viscosity, cost effective, quick gel @ RT
TBD PC110 Epoxy Potting Compound 2 Part, thermal 8750 140 55/203 High adhesion to metals glass and plastics, very moisture resistant
TBD PC112 Epoxy Potting Compound 2 Part, thermal 50,000 48   Quick gel , 3 hrs @ RT
674 PC2001 Epoxy Potting Compound 1 part, thermal 25,000 110 30/175 Low modulus fill, low cure stress, low warpage
TBD PC400 Epoxy Potting Compound 2 part, thermal 10,000 80 32/80 Highly filled, high thermal conductivity (1.2 W/m-K) UL-V0
TBD PC410 Epoxy Potting Compound 2 part, thermal 35,000 85 21/55 Highly filled, high thermal conductivity (1.4xx) UL-V0
844 PC7010 UV Curable Encapsulant

1200 45 -40/125
677 CC1001 Conformal Coat 1 part, thermal 110 120 70/170 Solvent based, high gloss, superior wetting, low warp.
684 CC1002 Conformal Coat 1 part, thermal 400 120 70/170 Solvent based, high gloss, superior wetting, low warp.
685 CC1003 Conformal Coat 1 part, thermal 600 120 70/170 Solvent based, high gloss, superior wetting, low warp.
686 CC1004 Conformal Coat 1 part, thermal 2000 120 70/170 Solvent based, high gloss, superior wetting, low warp.
687 CC1011 Conformal Coat 1 part, thermal 110 120 70/170 Solvent based, high gloss, superior wetting, low warp.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 
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Conformal Coat
Electronic Encapsulants, Potting Compounds and Coatings
Epoxy Encapsulant Kit
PC200 A&B
Potting Compound Liquid Encapsulant PC101A&B
Potting Compound Liquid Encapsulant SD801A&B
Potting Compound PC2001