LoSTRESS™ Liquid Encapsulant is a new generation low modulus fill material specifically designed to offer low cure stress and low warpage.
These encapsulants are novel, epoxy-based 100% solids, single component liquid semiconductor encapsulants designed for devices requiring high toughness, flame retardancy and strong adhesion to various substrates such as metal, ceramic and organic. LoSTRESS™ is especially suitable for SAW filter applications. LoSTRESS™ can virtually eliminate warp on ceramic substrates due to the low cure stress. Dam and fill and glob top versions are available.