LoSTRESS™ Liquid Encapsulants are a new generation low modulus fill material specifically designed to offer low cure stress and low warpage.
These encapsulants are novel, epoxy-based 100% solids, single component liquid semiconductor encapsulants designed for devices requiring high toughness, flame retardancy and strong adhesion to various substrates such as metal, ceramic and organic. LoSTRESS™ is especially suitable for SAW filter applications.
LoSTRESS™ can virtually eliminate warp on ceramic substrates due to the low cure stress. Dam and fill and glob top versions are available.
Key Benefits:
- Very little warpage on HTC and LTCC substrates for easy downstream process
- Minimal cure stress on sensitive devices such as SAW filters
- High adhesion to die, substrates and most other interfacing materials
LoSTRESS™ Product Line
Click on Cat. # to view product detail, or TDS # to view product datasheet:
|
Cat. #
|
TDS #
|
Viscosity (kCps)
|
Optimum Cure hours/°C
|
Tg °C
|
CTE1, ppm
|
Modulus (Mpa)
|
Durometer
|
| PC440 |
932 |
0.2 |
2h/80 |
-10 |
30 |
3 |
70D |
| PC7010 |
844 |
30 |
UV |
45 |
150 |
2 |
75A |
| SF50 |
926 |
20 |
1h/160 |
-60 |
150 |
5 |
40A |
| SF5002 |
638
|
10
|
1h/150+1h/160
|
-20
|
150
|
5
|
80A
|
|
SF5021
|
881
|
5
|
UV 10 sec.
|
0
|
150
|
5
|
70A
|
| SF54GB |
651 |
25 |
1h/150+1h/160 |
-20 |
150 |
5 |
30D |
For additional information or assistance selecting the right material, please contact: gsandgren@polysciences.com