EdgeCONTROL™ DAM Materials
EdgeCONTROL™ Dam Encapsulants are 100% solid, single component, silica filled, liquid epoxy systems used for many applications.
The materials are particularly useful as retention dams for liquid encapsulation or as a stencil printable overmold. EdgeCONTROL™ has good adhesion to various rigid and flexible organic and inorganic substrates. High viscosity and high thixotropic index allow it to maintain its profile in the wet and cured state without slumping.
EdgeCONTROL™ products are available in a full range of properties from high Tg, high modulus polymers to tough and elastomeric.
TDS |
Cat. #
|
Specific
Gravity
|
Viscosity
@25°C
(CPS) |
Tg
(ºC)
|
Modulus
@25°C
(Mpa) |
CTE
ά1/ά2
(ppm/ºC) |
Optimum Cure
Schedule
(ºC) |
|
SD54G0 |
1.0 |
1000K |
<20 |
1 |
130/250 |
90 min @ 90+
60 min @ 150+
60 min @ 160 |
| 661 |
SD502C |
1.0 |
1000K |
<20 |
1 |
130/250 |
90 min @ 90+
60 min @ 150+
60 min @ 160 |
| 662 |
SD8001 |
1.76 |
|
160 |
|
18/50 |
Co-cure with NoSWEEP™
90 min @ 100+
60 min @ 165 |
| 673 |
SD6002 |
2.13 |
230K |
170 |
|
|
90 min @ 60+
30 min @ 90+
60 min @ 125 |
| 709 |
SD1000 |
1.13 |
5500K |
55 |
500 |
100/200 |
Co-cure with OptiCLEAR™
120 min @ 120+
120 min @ 150 |
| 708 |
SD1010 |
1.21 |
5500K |
160 |
12 |
50/160 |
Co-cure with NoSWEEP™
120 min @ 120+
120 min @ 150 |
StenSEAL® Stencil Applied Encapsulant
StenSEAL® is designed to work best with packages that have the wires encapsulated with NoSWEEP™ Wire Bond Encapsulant or on the backside of die such as LOC and BOC.
TDS |
Cat. #
|
Specific
Gravity
|
Viscosity
@25°C
(CPS) |
Tg
(ºC)
|
Modulus
@25°C
(Mpa) |
CTE
ά1/ά2
(ppm/ºC) |
Optimum Cure
Schedule
(ºC) |
| 663 |
ES8001 |
2.13 |
230K |
>170 |
5000 |
17/45 |
90 min @ 60+
30 min @ 90+
60 min @ 125 |
ZipCURE™ Die Attach
ZipCURE™ Die Attach is a silver filled thermally conductive JEDEC level 2, Lead Free (260C reflow) die attach designed for a multitude of package types. ZipCURE is extremely hydrophobic, allowing high adhesion under high humidity conditions.
TDS |
Cat. #
|
Specific
Gravity
|
Viscosity
@25°C
(CPS) |
Tg
(ºC)
|
Modulus
@25°C
(Mpa) |
CTE
ά1/ά2
(ppm/ºC) |
Optimum Cure
Schedule
(ºC) |
682 |
DC1001 |
4.43 |
75K |
55 |
10 |
40/140 |
15 min @ 185 |
| |
DC2000 |
1.2 |
20K |
130 |
15 |
60/170 |
30 min @ 150 |
For more information or for help selecting the right material please contact us via email: gsandgren@polysciences.com