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Electronic Materials
 

High Temperature

Click on Cat. # to view product detail, or TDS # to view product datasheet:

Cat. #

TDS #

Viscosity (kCps)

Optimum  Cure hours/°C

Tg °C

CTE1, ppm

Modulus (Mpa)

Durometer 

ES8010 936 250 1h/100+1h/165 180 15 3500 90D

EW7072

640

150

2h/130+2h/170

180

15

4000

80D

EW8002

667

50

1h/100+1h/165

150

15

3500

85D

EW8002N 891 50 1h/100+1h/165 150 15 3500 85D

EW8003

680

100

1h/100+1h/165

170

12

4000

85D

EW8004 929 50 0.5h/150 160 15 3500 85D
HV200 904 30 0.5/60 <-70 250 1 30A
HV300 696 10 1h/60 <-70 200 3 50A
HV330 892 30 1h/60 <-70 150 5 80A
HV400 701
10
1h/60 <-70 150 5 80A
PC570 934 1 5min/150 130 60 400 85D
PC600 705 0.2

1h/100+1h/ 150+1h/200

200 60 1000 90D
PC610 899 20 1h/150 150 50 3200 85D
PC620 707 20 2h/150+2h/200 210 50 3550 90D
PC1100 941 15 1h/150+1h/160 155 30 2500 90D
PC1200 935 65 1h/100+1h/165 195 16 2500  90D
PC7050 942 0.5 UV 10" 120 75 200 75D
SD1010 708 1000 1h/100+1h/165 165 40 2000 85D
SD1011 925 30 1h/100+1h/165 180 15 4000 85D
SD8002 927 200 1h/100+1h/165 150 15 3500 85D
SF850 870 0.5 1.5h/150 150 60 500 80D
SF860 903 1.5 2h/120 150 80 400 80D

For additional information or assistance selecting the right material, please contact: gsandgren@polysciences.com

 
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EdgeCONTROL™ (Dam Encapsulant) SD8002
EdgeCONTROL™ Dam Encapsulant SD1010
EdgeCONTROL™ Damm SD1011
NoSWEEP™ Epoxy EW8002N
NoSWEEP™ Liquid Encapsulent EW8004
NoSWEEP™ Wire Bond Encapsulant - EW7072
NoSWEEP™ Wire Bond Encapsulant EW8002
NoSWEEP™ Wire Bond Encapsulant EW8003
OptiCLEAR™ Liquid Encapsulant Fill SF850 A&B
OptiCLEAR™ Liquid Encapsulant Fill SF860 A&B
ES8010 StenSEAL™
Liquid Encapsulant HV300A&B
Liquid Encapsulant HV400A&B
PC1100 Epoxy Adhesive Kit
PC1200 Epoxy Adhesive Kit
PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant
PC600 A&B Potting Compound Liquid Encapsulant
PC610 A&B High IR Absorption Epoxy Product
PC620 A&B Potting Compound Liquid Encapsulant
PC7050 UV Curable Epoxy