LoSTRESS™ Liquid Encapsulants are a new generation low modulus fill material specifically designed to offer low cure stress and low warpage.
These encapsulants are novel, epoxy-based 100% solids, single component liquid semiconductor encapsulants designed for devices requiring high toughness, flame retardancy and strong adhesion to various substrates such as metal, ceramic and organic. LoSTRESS™ is especially suitable for SAW filter applications.
LoSTRESS™ can virtually eliminate warp on ceramic substrates due to the low cure stress. Dam and fill and glob top versions are available.
Key Benefits:
- Very little warpage on HTC and LTCC substrates for easy downstream process
- Minimal cure stress on sensitive devices such as SAW filters
- High adhesion to die, substrates and most other interfacing materials
LoSTRESS™ Product Line
|
TDS
|
Product Number
|
Type
|
Cure Type
|
Viscosity (CPS)
|
Tg
(C)
|
CTE
ά1 / ά2
(ppm/C)
|
Description |
|
638
|
SF5002
|
Encapsulant, low cure stress
|
1 part -Thermal
|
11,000
|
<20
|
149/240
|
Low modulus, JEDEC L3-260, Black |
|
672
|
SF54GA
|
Encapsulant, low cure stress
|
1 part -Thermal
|
30,000
|
<20
|
130/250
|
Low modulus, excellent heat aging reliability, JEDEC L3-260, Green FR, Black |
|
651
|
SF54GB
|
Encapsulant, low cure stress
|
1 part -Thermal
|
30,000
|
<20
|
130/250
|
Low modulus, JEDEC L3-260, Good heat aging reliability, Green FR, Black
|
|
657
|
SF501C
|
|
|
|
<20
|
TBD
|
|
|
669
|
SF504A
|
Encapsulant, low cure stress
|
1 part UV or Thermal
|
25,000
|
<20
|
130/200
|
Low modulus, excellent heat aging reliability, JEDEC L3-260, Green FR, Clear
|
For more information or for help selecting the right material please contact us via email: gsandgren@polysciences.com