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Electronic Materials

 

NoSWEEP™ Encapsulants

NoSWEEP™ Encapsulants

<i>No</i><b>SWEEP</b>™ EncapsulantsNoSWEEP™ Wire Bond Encapsulant is a novel, 100% solids, single component, filled liquid designed for encapsulation of semiconductor devices comprising wire bonds with very narrow diameters, long wires, and ultra fine pitch.

NoSWEEP™ semiconductor encapsulant is dispensed onto the wires immediately after wire bonding, flowing easily between and around the wires without causing sweep or sag and without voids.  NoSWEEP™ is quickly jelled with UV energy to lock the wires in place so the device can be handled and molded with no damage to the wires. Additionally Polysciences has developed a NoSWEEP™ EW7073 system for LQFP and stacked die consisting of a micro extruded ring or line which locks the wires and virtually eliminates wire sweep and sway.

NoSWEEP

Key Benefits vs. Conventional Molding Systems:

 

  • Enables implementation of sub-35µm pitch roadmap wire bonding.
  • Allows for the use of longer wires with low cost, high-density substrates and enables simple die shrinks.
  • Enables cost reduction through the use of thinner diameter gold wire.
  • Simplifies the design and production of complex stacked die and other 3-D package designs.
  • NoSWEEP™ is Lead Free compatible.
  •  

    TDS Product Description Cure Type

    Viscosity (cps)

    Tg (C)

    CTE
    ά1 / ά2
    (ppm/C)

    Other

    640

    EW7072

    NoSWEEP wire encapsulant or Glob top

    1 part UV &/or thermal

    115,000

    180

    14/29

    Glob top &/or anti sweep wire encapsulant

    626

    EW7073

    NoSWEEP encapsulant

    1 part UV & thermal

    250,000

    174

    23/63

    Wire locking encapsulant for ring or bead dispense. JEDEC 2A, 260.

    667

    EW8002

    NoSWEEP Glob top

    1 part -Thermal

    50,000

    160

    20/70

    Low visc. Version of EW8003

    680

    EW8003

    NoSWEEP Glob top

    1 part -Thermal

    250,000

    160

    18/50

    Fine wire pitch glob top, JEDEC 2A,260

    TBD

    EW2000

    NoSWEEP Glob top

    1 part UVA 7.5J/cm2

    1,000,000

    207

    14/35

    Excellent for RFID, smart card and similar applications

    MSDS / Technical Data Sheets

    Please select a Continent for pricing information.
    Catalog No. Packaging Size Price Quantity
    EW707000-1
    Size:  please inquire for pricing