NoSWEEP™ Wire Bond Encapsulant EW8001

NoSWEEP^™ offers the following distinct advantages over conventional molding systems: 

• Enables implementation of 35μm pitch roadmap wire bonding

• Allows for the use of longer wires with low cost, high-density substrates and enables simple die shrinks.

• Enables cost reduction through the use of thinner diameter gold wire
• Room temperature stable.