LoSTRESS™ Liquid Encapsulants
LoSTRESS™ Liquid Encapsulants
LoSTRESS™ Liquid Encapsulant is a new generation low modulus fill material specifically designed to offer low cure stress and low warpage.
These encapsulants are novel, epoxy-based 100% solids, single component liquid semiconductor encapsulants designed for devices requiring high toughness, flame retardancy and strong adhesion to various substrates such as metal, ceramic and organic. LoSTRESS™ is especially suitable for SAW filter applications. LoSTRESS™ can virtually eliminate warp on ceramic substrates due to the low cure stress. Dam and fill and glob top versions are available.
Key Benefits:
• Very little warpage on HTC and LTCC substrates for easy downstream process.
• Minimal cure stress on sensitive devices such as SAW filters.
• High adhesion to die, substrates and most other interfacing materials.
SF5002 LoSTRESS Liquid Encapsulant
SF54GB LoSTRESS Liquid Encapsulant
SF501C LoSTRESS Liquid Encapsulant
SF54GA LoSTRESS Liquid Encapsulant
SF504A LoSTRESS Liquid Encapsulant
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TDS
|
Product Number
|
Type
|
Cure Type
|
Viscosity (CPS)
|
Tg
(C)
|
CTE
ά1 / ά2
(ppm/C)
|
Description |
|
638
|
SF5002
|
Encapsulant, low cure stress
|
1 part -Thermal
|
11,000
|
<20
|
149/240
|
Low modulus, JEDEC L3-260, Black |
|
672
|
SF54GA
|
Encapsulant, low cure stress
|
1 part -Thermal
|
30,000
|
<20
|
130/250
|
Low modulus, excellent heat aging reliability, JEDEC L3-260, Green FR, Black |
|
651
|
SF54GB
|
Encapsulant, low cure stress
|
1 part -Thermal
|
30,000
|
<20
|
130/250
|
Low modulus, JEDEC L3-260, Good heat aging reliability, Green FR, Black
|
|
669
|
SF504A
|
Encapsulant, low cure stress
|
1 part UV or Thermal
|
25,000
|
<20
|
130/200
|
Low modulus, excellent heat aging reliability, JEDEC L3-260, Green FR, Clear
|
Please select a Continent for pricing information.
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SF500X000-1
|
| Size: |
please inquire for pricing |
|
|