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Potting Compound Liquid Encapsulant PC101A&B

Potting Compound Liquid Encapsulant PC101A&B

This formulation is a filled epoxy resin designed for potting and encapsulation. It is a silica filled liquid encapsulant formulated to have a room temperature cure, excellent moisture resistance and cure to a high finished strength. This formulation has a very low exotherm.

MSDS / Technical Data Sheets

Data Sheet #676:Potting Compound Liquid Encapsulant PC101A & PC101B (PDF)

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Catalog No. Packaging Size Price Quantity

PC101A&B

Size:

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