StenSEAL™ Liquid Encapsulant

StenSEAL encapsulant offers you a cost effective alternative to glob tops and transfer molding, with minimal capital investment required. It is applied with a stencil printer, helping to speed the encapsulation process.

StenSEAL is designed to work best with packages that have the wires encapsulated with NoSWEEP™ Wire Bond Encapsulant or on the backside of die such as LOC and BOC.