Encapsulant Dam is a low modulus retention material that delivers low cure stress and low warpage during liquid encapsulation of BGA and MCM packages. It cures simultaneously with the encapsulant and provides excellent adhesion to various substrates. Encapsulant Dam is ideal for use with Polysciences Electronic Polymers.
SD502C EdgeControl Encapsulant Dam
SD6002 EdgeControl Encapsulant Dam
SD8001 EdgeControl Encapsulant Dam