EdgeCONTROL™ (Dam Encapsulant) SD502C
EdgeCONTROL™ (Dam Encapsulant) SD502C
A low modulus retention dam specifically formulated to offer low cure stress and low warpage for liquid encapsulation of BGA and MCM packages. EdgeCONTROL is dedigned to be used with LoSTRESS™ Liquid Encapsulants. Both can be cured simultaneously.
Please select a Continent for pricing information.
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SD502C
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please inquire for pricing |
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