Polysciences, Inc. produces a unique array of microelectronic grade encapsulants, adhesives, coatings and potting compounds. These ultra pure materials offer a wide selection of performance criteria such as viscosity, UV or thermal cure, low or high modulus, screen printable, low CTE, green fire retardant, lead free etc. For applications ranging from PBGA, QFP and smart card encapsulations to wafer level coatings.
Polysciences, Inc. manufactures a wide range of polymers for the microelectronic and electronic markets including: epoxy encapsulants, glob tops, die attach, wafer level coatings, underfills, conformal coatings, potting compounds, silicone adhesives, thermally conductive polymers and wire sweep eliminating polymers. Additionally, we offer chemicals for CMP, and can custom formulate materials for your unique needs, including synthesis of new or rare polymers in R&D volumes.
For more information, or for help selecting the right material please contact us via email: nvarga@polysciences.com
We pride ourselves in providing a high level of customer service for ALL customers.