Chemicals for CMP (Chemical Mechanical Polishing)
Chemicals for CMP (Chemical Mechanical Polishing)
Polysciences offers a several unique surfactants/particle suspension aids for using in CMP. In addition to the ultra-pure semiconductor grade listed below, we can custom formulate or synthesize materials for your specific requirements. Poly(acrylic acid) nominal MW 5,000 electronics grade Catalog # 24600
Poly(acrylic acid) nominal MW 10,000 electronics grade Catalog # 24597
Poly(acrylic acid) nominal MW 15,000 electronics grade Catalog # 24598
Poly(acrylic acid) nominal MW 30,000 electronics grade Catalog # 24601
Poly(acrylic acid) nominal MW 50,000 electronics grade Catalog # 24599
We also offer specially branched polyacrylic acids which can provide particle sieve benefits, please contact us at 1-800-523-2575 or 1-215-343-6484 or email: info@polysciences.com.
Please select a Continent for pricing information.
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EChem1005-1
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