A novel, 100% solids, one component, silica filled liquid encapsulant designed for encapsulation of very narrow diameter, long and ultra fine pitch wire bonds on semiconductor devices. NoSWEEP™ is dispensed onto the wires immediately after wire bonding, flowing easily between and around the wires without causing sweep or sag and without voids. It is quickly gelled with UV energy to lock the wires in place so the device can be handled and molded with no damage to the wires.