A highly filled epoxy resin designed for potting and encapsulation where high thermal conductivity is required. It is a liquid encapsulant formulated to have excellent moisture resistance, low CTE and to cure to a high finished strength. PC620 has been tested in our laboratories to be UL 94V-0. PC620 will be completely cured in 5-7 days at room temperature but can be accelerated with mild heating of 60°C to 100°C for 2-4 hours. Can be used with a variety of curatives to achieve a diverse range of cured and handling properties.
(800) 523-2575 or (215) 343-6484 | fax: (800) 343-3291 or (215) 343-0214 | email@example.com
Polysciences Europe GmbH
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Polysciences Asia Pacific, Inc.
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