A low modulus retention dam specifically formulated to offer low cure stress and low warpage for liquid encapsulation of BGA and MCM packages. Has good adhesion to various rigid and flexible organic and ceramic substrates. High viscosity and high thixotropy allow it to maintain its profile while wet and during curing without slumping. EdgeCONTROL™ is designed to be used with NoSWEEP™ EW8000 Series Encapsulant. Both can be cured simultaneously.
(800) 523-2575 or (215) 343-6484 | fax: (800) 343-3291 or (215) 343-0214 | email@example.com
Polysciences Europe GmbH
(49) 6221-765767 | fax: (49) 6221-764620 | firstname.lastname@example.org
Polysciences Asia Pacific, Inc.
(886) 2 8712 0600 | fax: (886) 2 8712 2677 | email@example.com
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