NoSWEEP™ - Wire Bond Encapsulant / EW7073
NoSWEEP™ - Wire Bond Encapsulant / EW7073
NoSWEEP™ Wire Bond Encapsulant is a novel, 100% solids, one component, filled liquid designed for encapsulation of semiconductor devices comprising wire bonds with very narrow diameters, long wires and ultra fine pitch. NoSWEEP™ is dispensed onto the wires immediately after wire bonding, flowing easily between and around the wires without causing sweep or sag and without voids. NoSWEEP™ is quickly gelled with UV energy to lock the wires in place so the device can be handled with no damage to the wires.
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