Die Attach

Die Attach

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
DC2000

Non-conductive epoxy designed for die attach bonding. Good durability, good adhesion, & low cure stress on sensitive devices. Thermally curable.

20 30/150 + 15/165 60/160 2000 90D N/A