Conformal Coatings

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  1. CC1001 Conformal Coat

    CC1001 Conformal Coat

    NT$0.00

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    An epoxy based conformal coating. The product has been designed for coating and sealing of electronic components requiring high heat resistance and durability. The product has excellent adhesion, chemical resistance and is easy to process.

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  2. DC2000 ZipCURE™

    DC2000 ZipCURE™

    NT$0.00

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    Non-conductive epoxy designed for die attach bonding. Good durability, good adhesion, & low cure stress on sensitive devices. Thermally curable.

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  3. EW8007 NoSWEEP™ Wire Bond Encapsulant

    EW8007 NoSWEEP™ Wire Bond Encapsulant

    NT$0.00

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    High performance epoxy for encapsulation applications. Well suited for many bonding & sealing uses requiring high modulus & high temperature resistance. Thermally curable.

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  4. UC5001 EasyFILL™

    UC5001 EasyFILL™

    NT$0.00

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    Rapid curing capillary flow underfill with low stress cure, high durability, high Tg, & low CTE. Thermally curable.

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  5. WL2000 Wafer Level Coating

    WL2000 Wafer Level Coating

    NT$0.00

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    Epoxy based protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.

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  6. WL2010 Wafer Level Coating

    WL2010 Wafer Level Coating

    NT$0.00

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    Epoxy based, protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.

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  7. WL4000 Wafer Level Coating

    WL4000 Wafer Level Coating

    NT$0.00

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    Epoxy based negative photoresist coating suited for applications at the wafer level.
    Rapidly curable by UV light, good adhesive properties.

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