Damms

6 个项目

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  1. SD54G0 EdgeCONTROL™

    SD54G0 EdgeCONTROL™

    NT$0.00

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    Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic & ceramic substrates, high viscosity, high thixotropy, & thermally curable. Designed to be used with LoSTRESSTM liquid encapsulant.

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  2. EdgeCONTROL&#153 (Dam Material) SD8001

    EdgeCONTROL™ (Dam Material) SD8001

    NT$0.00

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    A 100% solids, single component, silica filled, liquid epoxy system used for many applications. This material was designed as a retention dam for liquid encapsulation or as a Stencil printable overmold.

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  3. SD1010 EdgeCONTROL™

    SD1010 EdgeCONTROL™

    NT$0.00

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    100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable. Designed to be used with NoSWEEPTM EW8000 series encapsulant.

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  4. SD1011 EdgeCONTROL™

    SD1011 EdgeCONTROL™

    NT$0.00

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    100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable.

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  5. SD8002 EdgeCONTROL™

    SD8002 EdgeCONTROL™

    NT$0.00

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    100% solids, liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants & other bonding uses requiring minimal flow during curing. Dimensional stability, low stress, & thermally curable.

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  6. PC7030 UV Curable Product

    PC7030 UV Curable Product

    开始于: NT$0.00

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    UV curable adhesive with excellent adhesion to a wide range of materials. Well suited for use in applications requiring bonding to hard to adhere substrates. Rigid, wide temperature use range, & cures in seconds.

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