SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill

组合的产品项目
Catalog Number Unit Size 价格 QTY
SF850K-1 1kg kit
NT$0.00
SF850A-500 500 g
NT$0.00
SF850B-500 500 g
NT$0.00
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2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ceramics.

Application(s):
Glob Top, Fill, Potting Compound
Shipping Requirements:
None
Tg:
150º C
Viscosity:
0.5
Appearance:
Clear colorless
Cure Type:
Thermal
CTE (ppm):
60
Modulus (MPa):
500
Durometer:
80D
Thermal Conductivity (W/m•K):
N/A
Polymer Type:
Epoxy
Cure Time/ Temp (hrs/°C):
01.05.0150
Glass Transition Temperature, Tg (ºC):
150
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