Potting Compounds

Potting Compounds

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
SF54GB

Low modulus, green flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring improves aging resistance, high toughness, green flame retardancy, & strong adhesion to various substrates such as metal, ceramic, & organic. Thermally curable.

25 1/150 + 1/160 150 5 30D N/A
PC570

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

1 0.08/150 60 400 85D N/A
SF801A&B

2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion to many substrates including metals, glass, & ceramics, low viscosity, & thermally curable.

0.3 1/80 125 20 50D N/A
HV100A&B

2 component clear silicone gel suitable for various applications. Inert, low modulus, low viscosity, clear, & thermally curable.

0.3 0.5/60 300 0.05 5A N/A
HV331

2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable.

0.2 0.3/65 200 0.1 20A N/A
SF503A Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable. 2 UV or 1/130 70 50 60D N/A
PC600A&B

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & very high Tg. Rapid thermal curing.

0,2 1/100 + 1/150 + 1/200 60 1000 90D N/A
PC1200

2 component epoxy encapsulant for applications requiring high thermal conductivity, heat resistance, rigidity, & dimensional stability. Excellent adhesion to many substrates including metals, themosetting plastics, & ceramics, good durability, high modulus, low CTE, & thermally curable.

65 1/150 + 1/165 15 2500 90D 1.1
PC410A&B

2 component, highly filled epoxy resin encapsulant designed for potting & encapsulation where high thermal conductivity is required. Excellent moisture resistance, low CTE, high strength, & room temperature or thermally curable.

70 1/80 50 250 93D 1,5
PC220

2 component, low viscosity epoxy well suited for various potting, sealing, & bonding applications.

0,4 4/RT 80 1000 80D N/A
PC420A&B

2 component, ceramic, non-metal filled, epoxy-based product designed for potting & encapsulation where high strength & thermal conductivity are required, particularly useful for the assembly of components requiring heat dissipation. Curable at room temperature or by heat.

40 1/100 50 500 88D 1,25
HV400A&B

2 component, addition cured silicone encapsulant designed for applications that require low stress & excellent electrical properties. Designed for potting & encapsulation where low cost & low viscosity is required. Room temperature or thermally curable.

10 1/60 150 5 80A N/A
HV200A&B

2 component, high strength, silicone elastomer with many useful features including a wide service temperature range of use, good environmental stability, & good cured flexibility. Well suited for many sealing & bonding applications, transluscent, low modulus, & thermally curable.

30 0.5/60 250 1 30A N/A
HV300A&B

2 component, silicone encapsulant designed for applications requiring high thermal conductivity & stability. Rapidly cures with moderate heat & easy to use.

10 1/60 200 3 50A 1.3
EW8002

100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.

50 1/100 + 1/165 15 3500 85D N/A
EW8007

High performance epoxy for encapsulation applications. Well suited for many bonding & sealing uses requiring high modulus & high temperature resistance. Thermally curable.

6 1/100 + 1/165 15 4000 90D N/A
SF5021

Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.

7 UV or 1/130 100 5 30D N/A
SF850K

2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ceramics.

0.5 01.05.0150 60 500 80D N/A
SF860

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring low color, good clarity, & high Tg. Cures rapidly at elevated temperature.

1.5 2/120 80 400 80D N/A