Underfills

Underfills

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
UC3111

Low modulus capillary flow underfill with low stress cure & high moisture resistance. Thermally curable.

2.5 1/130 + 1/150 80 >1000 85D N/A
UC5001

Rapid curing capillary flow underfill with low stress cure, high durability, high Tg, & low CTE. Thermally curable.

12 0.2/150 <30/110 1000 90D N/A