Wire Bond
Wire Bond
| Cat. # | Description | Viscosity (kCps) | Cure Time/ Temp (hrs/°C) | Tg (°C) | CTE (ppm) | Modulus (MPa) | Durometer | Thermal Conductivity (W/m•K) |
|---|---|---|---|---|---|---|---|---|
| EW8003 |
Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable. |
100 | 1/100 + 1/165 | 12 | 4000 | 85D | N/A | |
| EW8002-10 |
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions. |
50 | 1/100 + 1/165 | 15 | 3500 | 85D | N/A | |
| EW8004-10 |
100% solids liquid encapsulant designed for encapsulation of very narrow diameter, long & ultra fine pitch wire bonds on semiconductor devices. Cured thermally at lower temperatures than other wire bonding products & thus suitable for use on temperature sensitive substrates. Available in dam & fill or glob top versions. |
50 | 0.5/150 | 15 | 3500 | 85D | N/A | |
| EW8007 |
High performance epoxy for encapsulation applications. Well suited for many bonding & sealing uses requiring high modulus & high temperature resistance. Thermally curable. |
6 | 1/100 + 1/165 | 15 | 4000 | 90D | N/A |