Epoxies

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  1. CC1001 Conformal Coat

    CC1001 Conformal Coat

    NT$0.00

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    An epoxy based conformal coating. The product has been designed for coating and sealing of electronic components requiring high heat resistance and durability. The product has excellent adhesion, chemical resistance and is easy to process.

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  2. SD1010 EdgeCONTROL™

    SD1010 EdgeCONTROL™

    NT$0.00

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    100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable. Designed to be used with NoSWEEPTM EW8000 series encapsulant.

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  3. SD1011 EdgeCONTROL™

    SD1011 EdgeCONTROL™

    NT$0.00

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    100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable.

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  4. StenSEAL™ Liquid Encapsulant ES8001

    StenSEAL™ Liquid Encapsulant ES8001

    NT$0.00

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    A novel, 100% solids, one component, silica filled liquid encapsulants formulated to create a molded package appearance when applied by means of a stencil printer. Designed to work best with packages that have the wires encapsulated with NoSWEEP™ Wire Bond Encapsulant or on the backside of die such as LOC and BOC.

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  5. PC500 Potting Compound Structural Epoxy Adhesive

    PC500 Potting Compound Structural Epoxy Adhesive

    NT$0.00

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    Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable. 了解更多
  6. PC550A&B Versatile, Tough Epoxy Adhesive

    PC550A&B Versatile, Tough Epoxy Adhesive

    NT$0.00

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    2 component, epoxy adhesive designed for bonding & sealing when high strength & toughness is required. Non-rigid, tough, & good adhesive properties to many substrates including metals, composites, ceramics, many plastics, & especially good for bonding fiberglass. Room temperature or thermal curing.

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  7. PC520 Structural Epoxy Adhesive

    PC520 Structural Epoxy Adhesive

    NT$0.00

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    Low temperature curable, structural epoxy adhesive with high strength & durability. Useful for demanding bonding applications requiring high performance properties. Good adhesion to many metals, ceramics, & thermosetting plastics.

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  8. PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

    PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

    NT$0.00

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    2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

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  9. SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill

    SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill

    NT$0.00

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    2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion to many substrates including metals, glass, & ceramics, low viscosity, & thermally curable.

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  10. PC600 A&B Potting Compound Liquid Encapsulant

    PC600 A&B Potting Compound Liquid Encapsulant

    NT$0.00

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    2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & very high Tg. Rapid thermal curing.

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  11. PC1200 Epoxy Adhesive Kit

    PC1200 Epoxy Adhesive Kit

    NT$0.00

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    2 component epoxy encapsulant for applications requiring high thermal conductivity, heat resistance, rigidity, & dimensional stability. Excellent adhesion to many substrates including metals, themosetting plastics, & ceramics, good durability, high modulus, low CTE, & thermally curable.

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  12. PC410 A&B Potting Compound Liquid Encapsulant

    PC410 A&B Potting Compound Liquid Encapsulant

    NT$0.00

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    2 component, highly filled epoxy resin encapsulant designed for potting & encapsulation where high thermal conductivity is required. Excellent moisture resistance, low CTE, high strength, & room temperature or thermally curable.

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  13. PC220 Epoxy Encapsulant Kit

    PC220 Epoxy Encapsulant Kit

    NT$0.00

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    2 component, low viscosity epoxy well suited for various potting, sealing, & bonding applications.

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  14. PC420 A&B Thermally Conductive Epoxy

    PC420 A&B Thermally Conductive Epoxy

    NT$0.00

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    2 component, ceramic, non-metal filled, epoxy-based product designed for potting & encapsulation where high strength & thermal conductivity are required, particularly useful for the assembly of components requiring heat dissipation. Curable at room temperature or by heat.

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  15. EW8003 NoSWEEP™ Wire Bond Encapsulant

    EW8003 NoSWEEP™ Wire Bond Encapsulant

    NT$0.00

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    Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.

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  16. PC200 A&B Potting Compound Epoxy

    PC200 A&B Potting Compound Epoxy

    开始于: NT$0.00

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    A versatile, 2 part, fire resistant, room temperature curable epoxy. Useful as an adhesive, encapsulant or potting compound.

    Volume pricing available, please call (800) 523-2575 for information.

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  17. PC7050 UV Curable Epoxya

    PC7050 UV Curable Epoxya

    开始于: NT$0.00

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    UV curable epoxy product well suited for use in applications requiring high heat resistance, rigidity, & durability. Low viscosity, good adhesion, high modulus, high strength, & rapid cure.

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  18. UC3111 EasyFILL™

    UC3111 EasyFILL™

    NT$0.00

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    Low modulus capillary flow underfill with low stress cure & high moisture resistance. Thermally curable.

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