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EW8004 NoSWEEP™ Wire Bond Encapsulant

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Catalog No. Packaging Size 价格 数量
EW8004-10 10cc
NT$0.00

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描述

100% solids liquid encapsulant designed for encapsulation of very narrow diameter, long & ultra fine pitch wire bonds on semiconductor devices. Cured thermally at lower temperatures than other wire bonding products & thus suitable for use on temperature sensitive substrates. Available in dam & fill or glob top versions.

Molecular Weight:
<1000
Viscosity:
50
Hazards:
Skin sensitizer
Handling:
Gloves & chemical goggles

MSDS / Technical Data Sheets / Product Literature

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