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StenSEAL™ Liquid Encapsulant ES8001

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Catalog No. Packaging Size 价格 数量
ES8001 Please inquire for pricing
NT$0.00

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描述

A novel, 100% solids, one component, silica filled liquid encapsulants formulated to create a molded package appearance when applied by means of a stencil printer. Designed to work best with packages that have the wires encapsulated with NoSWEEP™ Wire Bond Encapsulant or on the backside of die such as LOC and BOC.

Tg:
180ºC
Viscosity:
250
Appearance:
Black Paste

MSDS / Technical Data Sheets / Product Literature