100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable. Designed to be used with NoSWEEPTM EW8000 series encapsulant.
- Black Paste