目录产品

SD1010 EdgeCONTROL™

View pricing for: Americas/Asia, Europe, Taiwan
Catalog No. Packaging Size 价格 数量
SD1010 30cc
NT$0.00
up down

Inquire for availability.

描述

100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable. Designed to be used with NoSWEEPTM EW8000 series encapsulant.

Tg:
165ºC
Viscosity:
1000
Appearance:
Black Paste

MSDS / Technical Data Sheets / Product Literature

RELATED PRODUCTS