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SD8002 EdgeCONTROL™

View pricing for: Americas/Asia, Europe, Taiwan
Catalog No. Packaging Size 价格 数量
SD8002 10cc
NT$0.00

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描述

100% solids, liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants & other bonding uses requiring minimal flow during curing. Dimensional stability, low stress, & thermally curable.

Molecular Weight:
<1000
Viscosity:
200
Hazards:
Skin sensitizer
Handling:
Gloves & chemical goggles

MSDS / Technical Data Sheets / Product Literature

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