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SF54GB LoSTRESS™ Liquid Encapsulant

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Catalog No. Packaging Size 价格 数量
SF54GB 3x30cc
NT$0.00

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描述

Low modulus, green flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring improves aging resistance, high toughness, green flame retardancy, & strong adhesion to various substrates such as metal, ceramic, & organic. Thermally curable.

Tg:
-20ºC
Viscosity:
25
Appearance:
Black Liquid

MSDS / Technical Data Sheets / Product Literature

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