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SF5021 OptiCLEAR™ Liquid Encapsulant Fill

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Catalog No. Packaging Size 价格 数量
SF5021-10 3x10cc
NT$2,870.00

描述

Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.

Tg:
0ºC
Viscosity:
7
Appearance:
Clear Liquid

MSDS / Technical Data Sheets / Product Literature