SF5021 OptiCLEAR™ Liquid Encapsulant Fill
有货
Ships on dry ice (+$45.00 to S&H).
Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.
Application(s):
Glob Top, Fill, Potting Compound
Tg:
0ºC
Viscosity:
7,000 cPs
Appearance:
Clear Liquid
Cure Type:
UV, Thermal
CTE (ppm):
100
Modulus (MPa):
5
Durometer:
30D
Thermal Conductivity (W/m•K):
N/A
Cure Time/ Temp (hrs/°C):
UV or 1/130
Glass Transition Temperature, Tg (ºC):
0ºC
