目录产品

SF503A OptiCLEAR™ Liquid Encapsulant Fill

View pricing for: Americas/Asia, Europe, Taiwan
Catalog No. Packaging Size 价格 数量
SF503A 3x10cc
NT$0.00

Inquire for availability.

描述

Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable.

Tg:
100º C
Viscosity:
2
Appearance:
CLear colorless

MSDS / Technical Data Sheets / Product Literature

RELATED PRODUCTS