Potting Compounds

Polysciences, Inc. is uniquely suited to manufacture a wide range of Epoxy and Silicone based Potting Compounds, Adhesives and Coatings. We have decades of experience manufacturing ultra pure high performance electronic materials.

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  1. SF54GB LoSTRESS™ Liquid Encapsulant

    SF54GB LoSTRESS™ Liquid Encapsulant

    NT$0.00

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    Low modulus, green flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring improves aging resistance, high toughness, green flame retardancy, & strong adhesion to various substrates such as metal, ceramic, & organic. Thermally curable.

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  2. SF5002 LoSTRESS™ Liquid Encapsulant

    SF5002 LoSTRESS™ Liquid Encapsulant

    NT$0.00

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    Low modulus, flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic.

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  3. PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

    PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant

    NT$0.00

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    2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

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  4. SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill

    SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill

    NT$0.00

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    2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion to many substrates including metals, glass, & ceramics, low viscosity, & thermally curable.

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  5. Silicone Gel Encapsulant HV100A&B

    Silicone Gel Encapsulant HV100A&B

    NT$0.00

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    2 component clear silicone gel suitable for various applications. Inert, low modulus, low viscosity, clear, & thermally curable.

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  6. HV331 Silicone Gel Kit

    HV331 Silicone Gel Kit

    NT$0.00

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    2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable.

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  7. SF503A OptiCLEAR™ Liquid Encapsulant Fill

    SF503A OptiCLEAR™ Liquid Encapsulant Fill

    NT$0.00

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    Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable. 了解更多
  8. PC600 A&B Potting Compound Liquid Encapsulant

    PC600 A&B Potting Compound Liquid Encapsulant

    NT$0.00

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    2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & very high Tg. Rapid thermal curing.

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  9. PC1200 Epoxy Adhesive Kit

    PC1200 Epoxy Adhesive Kit

    NT$0.00

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    2 component epoxy encapsulant for applications requiring high thermal conductivity, heat resistance, rigidity, & dimensional stability. Excellent adhesion to many substrates including metals, themosetting plastics, & ceramics, good durability, high modulus, low CTE, & thermally curable.

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  10. PC410 A&B Potting Compound Liquid Encapsulant

    PC410 A&B Potting Compound Liquid Encapsulant

    NT$0.00

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    2 component, highly filled epoxy resin encapsulant designed for potting & encapsulation where high thermal conductivity is required. Excellent moisture resistance, low CTE, high strength, & room temperature or thermally curable.

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  11. PC220 Epoxy Encapsulant Kit

    PC220 Epoxy Encapsulant Kit

    NT$0.00

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    2 component, low viscosity epoxy well suited for various potting, sealing, & bonding applications.

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  12. PC420 A&B Thermally Conductive Epoxy

    PC420 A&B Thermally Conductive Epoxy

    NT$0.00

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    2 component, ceramic, non-metal filled, epoxy-based product designed for potting & encapsulation where high strength & thermal conductivity are required, particularly useful for the assembly of components requiring heat dissipation. Curable at room temperature or by heat.

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  13. Liquid Encapsulant HV400A&B

    Liquid Encapsulant HV400A&B

    NT$0.00

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    2 component, addition cured silicone encapsulant designed for applications that require low stress & excellent electrical properties. Designed for potting & encapsulation where low cost & low viscosity is required. Room temperature or thermally curable.

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  14. HV200A&B Silicone Elastomer

    HV200A&B Silicone Elastomer

    NT$0.00

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    2 component, high strength, silicone elastomer with many useful features including a wide service temperature range of use, good environmental stability, & good cured flexibility. Well suited for many sealing & bonding applications, transluscent, low modulus, & thermally curable.

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  15. Liquid Encapsulant HV300A&B

    Liquid Encapsulant HV300A&B

    NT$0.00

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    2 component, silicone encapsulant designed for applications requiring high thermal conductivity & stability. Rapidly cures with moderate heat & easy to use.

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  16. PC200 A&B Potting Compound Epoxy

    PC200 A&B Potting Compound Epoxy

    开始于: NT$0.00

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    A versatile, 2 part, fire resistant, room temperature curable epoxy. Useful as an adhesive, encapsulant or potting compound.

    Volume pricing available, please call (800) 523-2575 for information.

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  17. PC7050 UV Curable Epoxya

    PC7050 UV Curable Epoxya

    开始于: NT$0.00

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    UV curable epoxy product well suited for use in applications requiring high heat resistance, rigidity, & durability. Low viscosity, good adhesion, high modulus, high strength, & rapid cure.

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  18. PC7010 UV Curable Encapsulant & Adhesive

    PC7010 UV Curable Encapsulant & Adhesive

    开始于: NT$0.00

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    Flowable, 100% solids, UV curable encapsulant & adhesive useful for potting & bonding applications which are subject to a wide temperature range of exposure.

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  19. PC7020 UV Curable Adhesive

    PC7020 UV Curable Adhesive

    开始于: NT$0.00

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    100% solids, UV curable adhesive useful for adhering many difficult to bond materials used for electronic & medical device assembly. Flowable viscosity, fast cure, tough, & elastomeric.

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  20. PC7030 UV Curable Product

    PC7030 UV Curable Product

    开始于: NT$0.00

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    UV curable adhesive with excellent adhesion to a wide range of materials. Well suited for use in applications requiring bonding to hard to adhere substrates. Rigid, wide temperature use range, & cures in seconds.

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  21. SF5021 OptiCLEAR™ Liquid Encapsulant Fill

    SF5021 OptiCLEAR™ Liquid Encapsulant Fill

    开始于: NT$2,870.00

    Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.

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  22. SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill

    SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill

    开始于: NT$300.00

    2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ceramics.

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