LoSTRESS™ Dam & Fill/Glob Top Encapsulants

LoSTRESS™

LoSTRESS™ epoxy encapsulants have a low modulus of elasticity which puts minimal cure stress on fragile ceramic and/or flexible substrates. These encapsulants are novel, epoxy-based 100% solids (non-volatile), single component liquid semiconductor encapsulants designed for devices requiring high toughness, flame retardancy, and strong adhesion to various substrates such as metal, ceramic, and organic. LoSTRESS™ is especially suitable for SAW filter applications. LoSTRESS™ can virtually eliminate warp on ceramic surfaces due to the low cure stress. Dam and fill and glob top versions are available.

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LoSTRESS Dam & Fill/Glob

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
PC7010

Flowable, 100% solids, UV curable encapsulant & adhesive useful for potting & bonding applications which are subject to a wide temperature range of exposure.

1.5 UV 150 2 75A N/A
SF54GB

Low modulus, green flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring improves aging resistance, high toughness, green flame retardancy, & strong adhesion to various substrates such as metal, ceramic, & organic. Thermally curable.

25 1/150 + 1/160 150 5 30D N/A
SF5002

Low modulus, flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic.

10 1/150 + 1/160 150 5 80A N/A
SF5021

Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.

7 UV or 1/130 100 5 30D N/A