UV Cure

5 个项目

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  1. SF503A OptiCLEAR™ Liquid Encapsulant Fill

    SF503A OptiCLEAR™ Liquid Encapsulant Fill

    NT$0.00

    Inquire for availability.

    Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable. 了解更多
  2. EW7072 NoSWEEP™ Wire Bond Encapsulant

    EW7072 NoSWEEP™ Wire Bond Encapsulant

    NT$0.00

    Inquire for availability.

    100% solid, silica filled liquid encapsulent for encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Thermally curable & non-sweeping. Available in dam & fill or glob top versions.

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  3. PC7050 UV Curable Epoxya

    PC7050 UV Curable Epoxya

    开始于: NT$0.00

    Inquire for availability.

    UV curable epoxy product well suited for use in applications requiring high heat resistance, rigidity, & durability. Low viscosity, good adhesion, high modulus, high strength, & rapid cure.

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  4. PC7010 UV Curable Encapsulant & Adhesive

    PC7010 UV Curable Encapsulant & Adhesive

    开始于: NT$0.00

    Inquire for availability.

    Flowable, 100% solids, UV curable encapsulant & adhesive useful for potting & bonding applications which are subject to a wide temperature range of exposure.

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  5. SF5021 OptiCLEAR™ Liquid Encapsulant Fill

    SF5021 OptiCLEAR™ Liquid Encapsulant Fill

    开始于: NT$2,870.00

    Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.

    了解更多