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EW7073 NoSWEEP™ Wire Bond Encapsulant

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Catalog No. Packaging Size 价格 数量
EW7073 10 cc
NT$0.00

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描述

100% solid, silica filled liquid encapsulant for encapsulation of narrow diameter, long, & ultra-fine pitch wire bonds on semiconductor devices. UV & thermally curable & non-sweeping. Available in dam & fill or glob top versions.

Tg:
160ºC
Viscosity:
250 kCps
Appearance:
Tan Paste

MSDS / Technical Data Sheets / Product Literature

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