Products

EW8007 NoSWEEP™ Wire Bond Encapsulant

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Catalog No. Packaging Size Price Quantity
EW8007 10cc
$0.00

Inquire for availability.

Description

High performance epoxy for encapsulation applications. Well suited for many bonding & sealing uses requiring high modulus & high temperature resistance. Thermally curable.

Viscosity:
6