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SF801 A&B OptiCLEAR™ Liquid Encapsulant FillCatalog Number SF801A&BInquire for availability.Phone: 1(800)523-2575Email: [email protected]2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion to many substrates including metals, glass, & ceramics, low viscosity, & thermally curable.
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HV331 Silicone Gel KitCatalog Number HV331Inquire for availability.Phone: 1(800)523-2575Email: [email protected]
2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable.
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EW8002 NoSWEEP™ Wire Bond EncapsulantCatalog Number EW8002-10
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.
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SF5021 OptiCLEAR™ Liquid Encapsulant FillCatalog Number SF5021
Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.
Glob Top
