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- Liquid Encapsulants - <i>Lo</i><b>STRESS</b>™ /
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Description
Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.
- Tg:
- 0ºC
- Viscosity:
- 7
- Appearance:
- Clear Liquid