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SF5021 OptiCLEAR™ Liquid Encapsulant Fill

View pricing for: Americas/Asia, Europe, Taiwan

Catalog No.	Packaging Size	Price	Quantity
SF5021-10	3x10cc	$0.00	up down

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Email: info@polysciences.com
Phone: 1 (800) 523-2575

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Description

Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable.

Tg:: 0ºC
Viscosity:: 7
Appearance:: Clear Liquid

MSDS / Technical Data Sheets / Product Literature

dataData Sheet #881
litHigh Performance Adhesives