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SF503A OptiCLEAR™ Liquid Encapsulant Fill

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Catalog No. Packaging Size Price Quantity
SF503A 3x10cc
$0.00

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Description

Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable.

Tg:
100º C
Viscosity:
2
Appearance:
CLear colorless

MSDS / Technical Data Sheets / Product Literature

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