Epoxy Based

32 Item(s)

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Epoxy

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
CC1001

An epoxy based conformal coating. The product has been designed for coating and sealing of electronic components requiring high heat resistance and durability. The product has excellent adhesion, chemical resistance and is easy to process.

0.1 1/150 70 2500 85D N/A
CC1002

Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat.

0.4 1/150 70 2500 85D N/A
CC1003

Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat.

0.6 1/150 70 2500 85D N/A
CC1004

Epoxy based coating & sealant with high heat resistance, chemical resistance, excellent adhesion & durability. Low viscosity, high gloss & curable by heat.

2 1/150 70 2500 85D N/A
SD1010

100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable. Designed to be used with NoSWEEPTM EW8000 series encapsulant.

1000 1/100 + 1/165 40 2000 85D N/A
SD1011

100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants. Dimensional stability, low stress, rigid, durable, high Tg, & thermally curable.

30 1/100 + 1/165 15 4000 85D N/A
SD8002

100% solids, liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants & other bonding uses requiring minimal flow during curing. Dimensional stability, low stress, & thermally curable.

200 1/100 + 1/165 15 3500 85D N/A
PC550A&B

2 component, epoxy adhesive designed for bonding & sealing when high strength & toughness is required. Non-rigid, tough, & good adhesive properties to many substrates including metals, composites, ceramics, many plastics, & especially good for bonding fiberglass. Room temperature or thermal curing.

40 4/RT 120 100 70D N/A
PC520

Low temperature curable, structural epoxy adhesive with high strength & durability. Useful for demanding bonding applications requiring high performance properties. Good adhesion to many metals, ceramics, & thermosetting plastics.

200 0.5/150 50 1200 80D N/A
PC620A&B

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

20 2/150 + 2/200 50 3550 90D N/A
ES8010

100% solid, silica filled epoxy with high strength, modulus, & heat resistance. Low warpage & good adhesion to die, substrates, & other inter facing materials. Applied by extrusion or screen-printing & thermally curable.

250 1/100 + 1/165 15 3500 90D N/A
SF54GB

Low modulus, green flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring improves aging resistance, high toughness, green flame retardancy, & strong adhesion to various substrates such as metal, ceramic, & organic. Thermally curable.

25 1/150 + 1/160 150 5 30D N/A
SF5002

Low modulus, flame retardant fill material specifically designed to offer low cure stress & low warpage. 100% solids, epoxy based liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic.

10 1/150 + 1/160 150 5 80A N/A
PC570

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.

1 0.08/150 60 400 85D N/A
SF801A&B

2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion to many substrates including metals, glass, & ceramics, low viscosity, & thermally curable.

0.3 1/80 125 20 50D N/A
PC600A&B

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & very high Tg. Rapid thermal curing.

0,2 1/100 + 1/150 + 1/200 60 1000 90D N/A
PC1200

2 component epoxy encapsulant for applications requiring high thermal conductivity, heat resistance, rigidity, & dimensional stability. Excellent adhesion to many substrates including metals, themosetting plastics, & ceramics, good durability, high modulus, low CTE, & thermally curable.

65 1/150 + 1/165 15 2500 90D 1.1
PC410A&B

2 component, highly filled epoxy resin encapsulant designed for potting & encapsulation where high thermal conductivity is required. Excellent moisture resistance, low CTE, high strength, & room temperature or thermally curable.

70 1/80 50 250 93D 1,5
PC220

2 component, low viscosity epoxy well suited for various potting, sealing, & bonding applications.

0,4 4/RT 80 1000 80D N/A
PC420A&B

2 component, ceramic, non-metal filled, epoxy-based product designed for potting & encapsulation where high strength & thermal conductivity are required, particularly useful for the assembly of components requiring heat dissipation. Curable at room temperature or by heat.

40 1/100 50 500 88D 1,25
EW8003

Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.

100 1/100 + 1/165 12 4000 85D N/A
EW8002

100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.

50 1/100 + 1/165 15 3500 85D N/A
DC2000

Non-conductive epoxy designed for die attach bonding. Good durability, good adhesion, & low cure stress on sensitive devices. Thermally curable.

20 30/150 + 15/165 60/160 2000 90D N/A
EW8007

High performance epoxy for encapsulation applications. Well suited for many bonding & sealing uses requiring high modulus & high temperature resistance. Thermally curable.

6 1/100 + 1/165 15 4000 90D N/A
UC3111

Low modulus capillary flow underfill with low stress cure & high moisture resistance. Thermally curable.

2.5 1/130 + 1/150 80 >1000 85D N/A
UC5001

Rapid curing capillary flow underfill with low stress cure, high durability, high Tg, & low CTE. Thermally curable.

12 0.2/150 <30/110 1000 90D N/A
WL2000

Epoxy based protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.

0.1 1/150 70 2500 85D N/A
WL2010

Epoxy based, protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or heat curable. Applied by brush, dip, spin coat, or spray methods.

0.1 1/150 70 2500 85D N/A
WL4000

Epoxy based negative photoresist coating suited for applications at the wafer level.
Rapidly curable by UV light, good adhesive properties.

0.1 UV 600-900 mJ + 1/150 <30 3000 85D N/A
SF850K

2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ceramics.

0.5 01.05.0150 60 500 80D N/A
SF860

2 component epoxy designed for bonding, encapsulating, & sealing applications requiring low color, good clarity, & high Tg. Cures rapidly at elevated temperature.

1.5 2/120 80 400 80D N/A
PC610K

2 component, epoxy product designed for applications requiring high absorption (low reflectivity) of infra red radiation. High heat resistance, high modulus, good dimensional stability, durabe, & thermally curable.

20 1/150 50 3200 85D N/A