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EasyFILL™ Underfills
EasyFILL™ Underfills
Polyscience's innovative EasyFILL™ Underfills products are characterized by their low stress cure and high durability. These capillary flow underfills lower stress, improve reliability and offer excellent processability for flip chip, CPS and BGA devices.
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EasyFILL™ Underfills
| Cat. # | Description | Viscosity (kCps) | Cure Time/ Temp (hrs/°C) | Tg (°C) | CTE (ppm) | Modulus (MPa) | Durometer | Thermal Conductivity (W/m•K) |
|---|---|---|---|---|---|---|---|---|
| UC3111 |
Low modulus capillary flow underfill with low stress cure & high moisture resistance. Thermally curable. |
2.5 | 1/130 + 1/150 | 80 | >1000 | 85D | N/A | |
| UC5001 |
Rapid curing capillary flow underfill with low stress cure, high durability, high Tg, & low CTE. Thermally curable. |
12 | 0.2/150 | <30/110 | 1000 | 90D | N/A |