NoSWEEP™ Wire Bond Encapsulants
NoSWEEP™
NoSWEEP™ wire bond encapsulants eliminate wire sweep during transfer molding by locking the wires together. This patented technology is ideal for ultra-fine pitch wire bonds, multi-tier bonding, and 3-D packaging. NoSWEEP™ can be dispensed on conventional off-line dispense systems or in-line on an on-wire bonder dispenser made by Kulike and Soffa. There are UV, UV/thermal, and thermal cure versions.
The thermal cure glob top versions of NoSWEEP™ are designed for full device encapsulation. These products offer JEDEC Level 2A reliability and are designed to work with lead free (260°C) re-flow. There is also a compatible dam for package designs which are not glob top friendly.
The patented technology Ring-lock dispense method (developed jointly with Kulike & Soffa) was created especially for lead-frame and 3-D packages. NoSWEEPs unique high performance epoxy chemistry allows a very small bead of material to be extruded across the wires. The material encapsulates a small section of the wires and is then UV gelled to lock the polymer and the wires in place before molding. Because only a very small amount of polymer is used, this process is an extremely cost effective solution for wire sweep and allows much broader design leeway.
5 Item(s)
NoSWEEP™ Wire Bond
| Cat. # | Description | Viscosity (kCps) | Cure Time/ Temp (hrs/°C) | Tg (°C) | CTE (ppm) | Modulus (MPa) | Durometer | Thermal Conductivity (W/m•K) |
|---|---|---|---|---|---|---|---|---|
| EW7073 |
100% solid, silica filled liquid encapsulant for encapsulation of narrow diameter, long, & ultra-fine pitch wire bonds on semiconductor devices. UV & thermally curable & non-sweeping. Available in dam & fill or glob top versions. |
250 kCps | UVA 1 J/cm2 @ 90 + 1/130 + 3/175 | 23 | 4000 | 80D | N/A | |
| EW8003 |
Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable. |
100 | 1/100 + 1/165 | 12 | 4000 | 85D | N/A | |
| EW7072 |
100% solid, silica filled liquid encapsulent for encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Thermally curable & non-sweeping. Available in dam & fill or glob top versions. |
150 kCps | 2/130 + 2/170 | 15 | 4000 | 80D | N/A | |
| EW8002-10 |
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions. |
50 | 1/100 + 1/165 | 15 | 3500 | 85D | N/A | |
| EW8004-10 |
100% solids liquid encapsulant designed for encapsulation of very narrow diameter, long & ultra fine pitch wire bonds on semiconductor devices. Cured thermally at lower temperatures than other wire bonding products & thus suitable for use on temperature sensitive substrates. Available in dam & fill or glob top versions. |
50 | 0.5/150 | 15 | 3500 | 85D | N/A |