NoSWEEP™ Wire Bond Encapsulants
NoSWEEP™ wire bond encapsulants eliminate wire sweep during transfer molding by locking the wires together. This patented technology is ideal for ultra-fine pitch wire bonds, multi-tier bonding, and 3-D packaging. NoSWEEP™ can be dispensed on conventional off-line dispense systems or in-line on an on-wire bonder dispenser made by Kulike and Soffa. There are UV, UV/thermal, and thermal cure versions.
The thermal cure glob top versions of NoSWEEP™ are designed for full device encapsulation. These products offer JEDEC Level 2A reliability and are designed to work with lead free (260°C) re-flow. There is also a compatible dam for package designs which are not glob top friendly.
The patented technology Ring-lock dispense method (developed jointly with Kulike & Soffa) was created especially for lead-frame and 3-D packages. NoSWEEPs unique high performance epoxy chemistry allows a very small bead of material to be extruded across the wires. The material encapsulates a small section of the wires and is then UV gelled to lock the polymer and the wires in place before molding. Because only a very small amount of polymer is used, this process is an extremely cost effective solution for wire sweep and allows much broader design leeway.
NoSWEEP™ Wire Bond
|Cat. #||Description||Viscosity (kCps)||Cure Time/ Temp (hrs/°C)||Tg (°C)||CTE (ppm)||Modulus (MPa)||Durometer||Thermal Conductivity (W/m•K)|
100% solid, silica filled liquid encapsulant for encapsulation of narrow diameter, long, & ultra-fine pitch wire bonds on semiconductor devices. UV & thermally curable & non-sweeping. Available in dam & fill or glob top versions.
|250 kCps||UVA 1 J/cm2 @ 90 + 1/130 + 3/175||23||4000||80D||N/A|
Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.
|100||1/100 + 1/165||12||4000||85D||N/A|
100% solid, silica filled liquid encapsulent for encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Thermally curable & non-sweeping. Available in dam & fill or glob top versions.
|150 kCps||2/130 + 2/170||15||4000||80D||N/A|
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.
|50||1/100 + 1/165||15||3500||85D||N/A|
100% solids liquid encapsulant designed for encapsulation of very narrow diameter, long & ultra fine pitch wire bonds on semiconductor devices. Cured thermally at lower temperatures than other wire bonding products & thus suitable for use on temperature sensitive substrates. Available in dam & fill or glob top versions.