NoSWEEP™ Wire Bond Encapsulants

NoSWEEP™

NoSWEEP™ wire bond encapsulants eliminate wire sweep during transfer molding by locking the wires together. This patented technology is ideal for ultra-fine pitch wire bonds, multi-tier bonding, and 3-D packaging. NoSWEEP™ can be dispensed on conventional off-line dispense systems or in-line on an on-wire bonder dispenser made by Kulike and Soffa. There are UV, UV/thermal, and thermal cure versions.

The thermal cure glob top versions of NoSWEEP are designed for full device encapsulation. These products offer JEDEC Level 2A reliability and are designed to work with lead free (260°C) re-flow. There is also a compatible dam for package designs which are not glob top friendly.

The patented technology Ring-lock dispense method (developed jointly with Kulike & Soffa) was created especially for lead-frame and 3-D packages. NoSWEEPs unique high performance epoxy chemistry allows a very small bead of material to be extruded across the wires. The material encapsulates a small section of the wires and is then UV gelled to lock the polymer and the wires in place before molding. Because only a very small amount of polymer is used, this process is an extremely cost effective solution for wire sweep and allows much broader design leeway.

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NoSWEEP Wire Bond

Cat. # Description Viscosity (kCps) Cure Time/ Temp (hrs/°C) Tg (°C) CTE (ppm) Modulus (MPa) Durometer Thermal Conductivity (W/m•K)
EW7073

100% solid, silica filled liquid encapsulant for encapsulation of narrow diameter, long, & ultra-fine pitch wire bonds on semiconductor devices. UV & thermally curable & non-sweeping. Available in dam & fill or glob top versions.

250 kCps UVA 1 J/cm2 @ 90 + 1/130 + 3/175 23 4000 80D N/A
EW8003

Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.

100 1/100 + 1/165 12 4000 85D N/A
EW7072

100% solid, silica filled liquid encapsulent for encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Thermally curable & non-sweeping. Available in dam & fill or glob top versions.

150 kCps 2/130 + 2/170 15 4000 80D N/A
EW8002

100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.

50 1/100 + 1/165 15 3500 85D N/A