Wire Bond & Globtop Encapsulants - NoSWEEP

NoSWEEP™ Wire Bond Encapsulants are novel, 100% solids, single component, filled liquid designed for encapsulation of semiconductor devices comprising wire bonds with very narrow diameters, long wires and ultra fine pitch.

Key Benefits vs. Conventional Molding Systems:
• Enables implementation of sub-35µm pitch roadmap wire bonding
• Allows for the use of longer wires with low cost, high-density substrates
and enables simple die shrinks
• Enables cost reduction through the use of thinner diameter gold wire
• Simplifies the design and production of complex stacked die and other 3-D package designs
NoSWEEP™ is Lead Free compatible

3 Item(s)

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  1. EW7073 NoSWEEP™ Wire Bond Encapsulant

    EW7073 NoSWEEP™ Wire Bond Encapsulant

    $0.00

    Inquire for availability.

    100% solid, silica filled liquid encapsulant for encapsulation of narrow diameter, long, & ultra-fine pitch wire bonds on semiconductor devices. UV & thermally curable & non-sweeping. Available in dam & fill or glob top versions.

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  2. EW8003 NoSWEEP™ Wire Bond Encapsulant

    EW8003 NoSWEEP™ Wire Bond Encapsulant

    $0.00

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    Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.

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  3. EW7072 NoSWEEP™ Wire Bond Encapsulant

    EW7072 NoSWEEP™ Wire Bond Encapsulant

    $0.00

    Inquire for availability.

    100% solid, silica filled liquid encapsulent for encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Thermally curable & non-sweeping. Available in dam & fill or glob top versions.

    Learn More