Products

NoSWEEP™ Encapsulants

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Catalog No. Packaging Size Price Quantity
EW707000-1 Please inquire for pricing
$0.00

Inquire for availability.

Description

NoSWEEP™ Wire Bond Encapsulant is a novel, 100% solids, single component, filled liquid designed for encapsulation of semiconductor devices comprising wire bonds with very narrow diameters, long wires, and ultra fine pitch.

NoSWEEP™ semiconductor encapsulant is dispensed onto the wires immediately after wire bonding, flowing easily between and around the wires without causing sweep or sag and without voids. NoSWEEP™ is quickly jelled with UV energy to lock the wires in place so the device can be handled and molded with no damage to the wires. Additionally Polysciences has developed a NoSWEEP™ EW7073 system for LQFP and stacked die consisting of a micro extruded ring or line which locks the wires and virtually eliminates wire sweep and sway.

NoSWEEP

Key Benefits vs. Conventional Molding Systems:

  • Enables implementation of sub-35µm pitch roadmap wire bonding.
  • Allows for the use of longer wires with low cost, high-density substrates and enables simple die shrinks.
  • Enables cost reduction through the use of thinner diameter gold wire.
  • Simplifies the design and production of complex stacked die and other 3-D package designs.
  • NoSWEEP™ is Lead Free compatible.

TDS Product Description Cure Type

Viscosity (cps)

Tg (C)

CTE
ά1 / ά2
(ppm/C)

Other

640

EW7072

NoSWEEP wire encapsulant or Glob top

1 part UV &/or thermal

115,000

180

14/29

Glob top &/or anti sweep wire encapsulant

626

EW7073

NoSWEEP encapsulant

1 part UV & thermal

250,000

174

23/63

Wire locking encapsulant for ring or bead dispense. JEDEC 2A, 260.

667

EW8002

NoSWEEP Glob top

1 part -Thermal

50,000

160

20/70

Low visc. Version of EW8003

680

EW8003

NoSWEEP Glob top

1 part -Thermal

250,000

160

18/50

Fine wire pitch glob top, JEDEC 2A,260

TBD

EW2000

NoSWEEP Glob top

1 part UVA 7.5J/cm2

1,000,000

207

14/35

Excellent for RFID, smart card and similar applications

MSDS / Technical Data Sheets / Product Literature