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PC400 A&B Potting Compound Liquid Encapsulant

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Catalog No. Packaging Size Price Quantity
PC400A&B Please inquire for pricing
$0.00

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Description

A highly filled epoxy resin designed for potting and encapsulation where high thermal conductivity and low viscosity is required. It is a liquid encapsulant formulated to have excellent moisture resistance, low CTE and to cure to a high finished strength. PC400 has been tested in our laboratories to be UL 94V-0. Will be completely cured in 5-7 days at room temperature but can be accelerated with mild heating of 60°C to 100°C for 2-4 hours. Can be used with a variety of curatives to achieve a diverse range of cured and handling properties.

Tg:
70ºC
Viscosity:
70
Appearance:
White Liquid

MSDS / Technical Data Sheets / Product Literature